Responsibilities; 

• Development/Review of production test plans to verify product performance, debug of Digital and Mixed-Signal SOC’s and statistical analysis of data in order to audit/set test limits per the data sheet specifications.

• Interact closely with Design Engineering, Test Engineering, Applications, Supply management team and the quality & Reliability Engineering to analyze/resolve issues as they relate to sample, pre-production, Qual plans and full production release of the product.

• Will need to review/drive semi-conductor test/manufacturing flows   (Wafer probe, Package test, BurnIn and System level test) with OSAT vendors/contractors.

• Drive designing/reviewing Burn-In, HTOL and other Quality & Reliability screens needed for the product qualification.

• Will need to work with internal and offshore test facilities to release products to production.

• Will be responsible for correlating the test solution to lab/manufacturing/customer platform in order to validate the product design, fabrication process, packaging technology and manufacturing robustness.

• Track product in production for yield management and quality excursions on an on-going basis.

Required:  

• Candidates will have a B.S. in Computer Engineering or Electrical Engineering plus 7 years of directly related experience, or equivalent experience and evidence of exceptional abilities.

• 5 years of experience in semiconductor product development. 

• 5 years of experience with developing tests, patterns/vectors, timing, and diagnostics on Automated Test Equipment.

• Ability to understand and analyze digital & analog mixed-signal  logic and circuits.

• Statistical analysis experience to determine population mean and outliers etc.

• Pareto analysis experience to drive debug and yield improvement processes 

• Debug experience in hardware, software, device, and/or manufacturing domains. 

• Experience with ATE testers/ equipment’s, logic analyzers, voltmeters, oscilloscopes, network analyzers, spectrum analyzers and other debug tools. 

• Experience with a scripting language (Perl, Python, shell script, or similar). 

• Good communication skills and the ability to work with geographically distributed product engineering teams. 

• Ensure all aspects of product manufacturing, including hardware, documentation, BOM’s and costing are in place for the production release of the product. 

• Understanding of Semiconductor Manufacturing test-flows (Wafer Probe, Package Assembly & Test, Burn-In, System Level Tests)

Preferred Skills: 

• Experience with C++, Java, C, or C#.

• Familiar with JTAG IEEE 1149.1 specification and other Design-For-Test/Debug features.

• Familiar with hardware description languages.

• Experience managing projects of 6-12 months duration.

• Familiarity with Automotive Quality standards, AEC Q100